| Annual · values | 2025 | 2024 | 2023 | 2022 | 2021 | 2020 |
|---|---|---|---|---|---|---|
| Gross Margin | 90.23% | 89.67% | 90.54% | 91.50% | 90.15% | 95.31% |
| Operating Margin | -46.95% | -54.74% | -65.48% | -57.28% | -57.48% | -11.87% |
| EBITDA Margin | -42.17% | -48.91% | -59.76% | -53.11% | -53.54% | -8.93% |
| Net Margin | -49.23% | -58.27% | -68.70% | -54.36% | -61.76% | -10.25% |
| Current Ratio | 1.13 | 1.17 | 1.26 | 1.86 | 2.51 | 1.03 |
| Quick Ratio | 1.13 | 1.17 | 1.26 | 1.86 | 2.51 | 1.03 |
| Debt / Equity | — | — | — | — | — | — |
| ROE | 237.47% | 2831.48% | -244.12% | -72.96% | -44.20% | 27.15% |
| ROA | -30.21% | -31.69% | -35.86% | -23.71% | -19.41% | -7.63% |
| Asset Turnover | 0.61 | 0.54 | 0.52 | 0.44 | 0.31 | 0.74 |
| Book Value / Share | -0.35 | -0.03 | 0.42 | 1.15 | 2.41 | -0.68 |
Arteris Inc. is a multinational fabless semiconductor intellectual property company specializing in network-on-chip (NoC) interconnect IP and system-on-chip (SoC) integration automation software. Headquartered in Campbell, California, it provides advanced System IP solutions that manage on-chip communications, connecting processors, memories, AI/ML accelerators, graphics subsystems, and I/O blocks via efficient NoC fabrics in SoCs and chiplet systems. Key products include FlexNoC for non-coherent interconnects, Ncore for cache coherence, CodaCache for memory subsystems, and FlexGen, a smart NoC IP that reduces wire length by up to 30%, latency by 10%, and boosts productivity 10x. Through acquisitions like Magillem, Semifore, and Cycuity, Arteris enhances IP packaging, hardware-software integration, and semiconductor cybersecurity. Serving sectors such as automotive (e.g., ADAS with clients like Bosch, Mobileye), AI/machine learning, communications (Samsung, NXP), consumer electronics, enterprise computing (AMD), industrial, and aerospace & defense, its technology has enabled over 900 design starts and shipment in more than 3.9 billion units, optimizing power, performance, area, and time-to-market for complex multi-die designs.