| Annual · values | 2025 | 2024 | 2023 | 2022 | 2021 | 2020 |
|---|---|---|---|---|---|---|
| Operating Cash Flow | 6.73 M USD | -720000 USD | -15.73 M USD | -6.77 M USD | -814000 USD | 2.16 M USD |
| Depreciation & Amortization | 3.38 M USD | 3.36 M USD | 3.07 M USD | 2.10 M USD | 1.49 M USD | 935000 USD |
| Stock-Based Compensation | 18.38 M USD | 15.94 M USD | 14.54 M USD | 11.69 M USD | 5.51 M USD | 458000 USD |
| Capital Expenditures | 1.39 M USD | 324000 USD | 1.50 M USD | 1.05 M USD | 808000 USD | 654000 USD |
| Cash Flow from Investing | 12.03 M USD | 970000 USD | -4.69 M USD | -37.48 M USD | -1.36 M USD | -5.15 M USD |
| Cash Flow from Financing | 1.42 M USD | -262000 USD | -2.92 M USD | -4.15 M USD | 76.25 M USD | 790000 USD |
| Dividends Paid | — | — | — | — | — | — |
| Stock Buybacks | — | — | — | — | — | — |
| Free Cash Flow | 5.34 M USD | -1.04 M USD | -17.23 M USD | -7.82 M USD | -1.62 M USD | 1.51 M USD |
Arteris Inc. is a multinational fabless semiconductor intellectual property company specializing in network-on-chip (NoC) interconnect IP and system-on-chip (SoC) integration automation software. Headquartered in Campbell, California, it provides advanced System IP solutions that manage on-chip communications, connecting processors, memories, AI/ML accelerators, graphics subsystems, and I/O blocks via efficient NoC fabrics in SoCs and chiplet systems. Key products include FlexNoC for non-coherent interconnects, Ncore for cache coherence, CodaCache for memory subsystems, and FlexGen, a smart NoC IP that reduces wire length by up to 30%, latency by 10%, and boosts productivity 10x. Through acquisitions like Magillem, Semifore, and Cycuity, Arteris enhances IP packaging, hardware-software integration, and semiconductor cybersecurity. Serving sectors such as automotive (e.g., ADAS with clients like Bosch, Mobileye), AI/machine learning, communications (Samsung, NXP), consumer electronics, enterprise computing (AMD), industrial, and aerospace & defense, its technology has enabled over 900 design starts and shipment in more than 3.9 billion units, optimizing power, performance, area, and time-to-market for complex multi-die designs.